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521075S Microelectronics Packaging Technologies, 5 ECTS cr 
Code 521075S  Validity 01.08.2015 -
Name Microelectronics Packaging Technologies  Abbreviation Microelectronic 
Scope5 ECTS cr   
TypeAdvanced Studies Discipline4306 Electrical Engineering 
TypeCourse   
  Grading1 - 5, pass, fail 
 
   
Unit Electrical Engineering DP 

Teachers
Name
Sami Myllymäki 

Description
ECTS Credits 

5

 
Language of instruction 

Finnish

 
Timing 

3rd period

 
Learning outcomes 

1. Upon completing the course student can explain how electronics packaging technology has since invention of transistors to current date and can estimate how this development is going to continue in future.

2. The student can describe can explain what is meant by microjoining techniques and what are the pros and cons of these.

3. The student can tell what different kind of materials, and why, are used in IC packaging technology.

4. The student can explain what is meant with system level packaging and how the strong miniaturization on IC requires new system level packaging techniques to be developed.

5. He can explain why active and passive components are being, more and more, embedded to be a part of the circuit board.

6. In addition, he can explain why and how radio electronics will be migrate towards circuit board and components on it.

 
Contents 

Radio technology applications are emphasized. Trends of packaging and component technologies. Area array packaging techniques. BGA-components. Micro joining and bonding. Multi-chip-modules: MCM-L, MCM-D and MCM-C modules. Fine line techniques. System level packaging (SOC, SOP). Multilayer substrates and integration of passive components. 3-D packaging. radio electronics modules. MEMS components. Electronics applications to nanotechnology.

 
Mode of delivery 

Face to face teaching

 
Learning activities and teaching methods 

Lecturing 24 h, practical work 12 h.

 
Target group 

Primarily major students of electrical engineering.

 
Prerequisites and co-requisites 

Recommended Introduction to Microfabrication Techniques.

 
Recommended optional programme components 

The course is an independent entity and does not require additional studies carried out at the same time.

 
Recommended or required reading 

Rao R. Tummala(edit): Fundamentals of microsystems packaging, New York, McGraw-Hill, 2001. R.R. Tummala and M. Swaminathan, Introduction to System-on-Package (SOP), McGraw-Hill, 2008.

 
Assessment methods and criteria 

The course is completed with the final exam and finished course work.

 
Grading 

The course unit utilizes a numerical grading scale 1-5.

 
Person responsible 

Sami Myllymäki

 
Working life cooperation 

No

 
Other information 

-

 


Current and future instruction
Functions Name Type ECTS cr Teacher Schedule
registration period has not begun Microelectronics Packaging Technologies  Course  Sami Myllymäki  10.01.22 -02.03.22

Future examinations
No examinations in WebOodi